CPZ28X-BZX55C22

Bare die,12.990 X 12.990 mils,0.5W Zener Diode

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
900 mV
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
0.077 %/°C
Power Dissipation (PD)
350 mW
Reverse Voltage Leakage Current (IR)
1 µA
Storage Temperature (Tstg)
-65 — 150 °C
Zener Impedance (ZZT)
30 Ω
Zener Knee Impedance (ZZK)
600 Ω
Zener Voltage (VZ)
11.4 — 12.6 V

(12 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ28X-BZX55C22-CT WafflePack@400 Limited Availability Bare die,12.990 X 12.990 mils,0.5W Zener Diode EAR99 8541.10.0040 PBFREE
CPZ28X-BZX55C22-WN Wafer Limited Availability Bare die,12.990 X 12.990 mils,0.5W Zener Diode EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPZ28X-BZX55C3V3_SERIES_WPD.PDF Device Datasheet
Material Composition:SOD-80 Material Composition
Package Detail Document:SOD-80 Package Detail Document
Product Reliability Data:SOD-80 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
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  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development