CPZ28X-CMPZ5241B

11V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

900 mV

Junction Temperature (T_j)

-65 — 150 °C

Maximum Temperature Coefficient (ΘV_Z)

0.076 %/°C

Power Dissipation (P_D)

350 mW

Reverse Voltage Leakage Current (I_R)

2 µA

Storage Temperature (T_stg)

-65 — 150 °C

Zener Impedance (Z_ZT)

22 Ω

Zener Knee Impedance (Z_ZK)

600 Ω

Zener Voltage (V_Z)

10.45 — 11.55 V

(11 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ28X-CMPZ5241B-CM	WafflePack@400		Limited Availability	11V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Glass Encapsulation	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CPZ28X-CMPZ5221B_SER_WPD.PDF	Device Datasheet
Material Composition:SOD-80	Material Composition
Package Detail Document:SOD-80	Package Detail Document
Product Reliability Data:SOD-80 Package Reliability	Product Reliability Data