CPZ48X-1N4115

22V,250mW Bare die,13.000 X 13.000 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1.1 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Zener Current (IZM)
10.8 mA
Noise Density (ND)
40
Power Dissipation (PD)
250 mW
Reverse Voltage Leakage Current (IR)
0.01 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
150 Ω
Zener Voltage (VZ)
20.9 — 23.1 V

(22 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ48X-1N4115-CT WafflePack@400 Active 22V,250mW Bare die,13.000 X 13.000 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPZ48X-1N4099-4135_WPD.PDF Device Datasheet
Material Composition:DO-35 Material Composition
Package Detail Document:DO-35 Package Detail Document
Process Change Notice:DO-35 Alternate Marking Process Change Notice
Product Reliability Data:DO-35 Package Reliability Product Reliability Data