CPZ48X-1N4115
22V,250mW Bare die,13.000 X 13.000 mils,Diode-Zener
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 200 mA
Test Conditions
IZT = 250 µA
Test Conditions
VR = 16.8 V
Test Conditions
IZT = 250 µA
Test Conditions
IZT = 250 µA
(22 V Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPZ48X-1N4115-CT | WafflePack@400 | Active | 22V,250mW Bare die,13.000 X 13.000 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
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| CPZ48X-1N4099-4135_WPD.PDF | Device Datasheet |
| Material Composition:SOD-123 | Material Composition |
| Package Detail Document:SOD-123 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
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