CPZ48X-1N4626

5.6V,250mW Bare die,13.000 X 13.000 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1 V

Junction Temperature (T_j)

-65 — 200 °C

Maximum Zener Current (I_ZM)

50 mA

Noise Density (N_D)

Power Dissipation (P_D)

250 mW

Reverse Voltage Leakage Current (I_R)

10 µA

Storage Temperature (T_stg)

-65 — 200 °C

Zener Impedance (Z_ZT)

1400 Ω

Zener Voltage (V_Z)

5.32 — 5.88 V

(5.6 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ48X-1N4626-CM200	WafflePack@200		Special Order Item	5.6V,250mW Bare die,13.000 X 13.000 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE
CPZ48X-1N4626-CT	WafflePack@400		Active	5.6V,250mW Bare die,13.000 X 13.000 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Glass Encapsulation	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CPZ48X-1N4614-4627_WPD.PDF	Device Datasheet
Material Composition:DO-35	Material Composition
Package Detail Document:DO-35	Package Detail Document
Process Change Notice:DO-35 Alternate Marking	Process Change Notice
Product Reliability Data:DO-35 Package Reliability	Product Reliability Data
Spice Model:Spice Model 1N4626	Spice Model