CPZ58X-1N4684

3.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1.5 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Change in Zener Voltage Over Current (ΔVZ)
950 mV
Maximum Zener Current (IZM)
80 mA
Power Dissipation (PD)
500 mW
Reverse Voltage Leakage Current (IR)
7.5 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Voltage (VZ)
3.135 — 3.465 V

(3.3 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ58X-1N4684-CM WafflePack@400 Active 3.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE
CPZ58X-1N4684-CT WafflePack@400 Active 3.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE
CPZ58X-1N4684-WN Wafer Active 3.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CPZ28X-1N4678-4717_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X Process Change Notice

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