CPZ58X-1N4697

10V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1.5 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Change in Zener Voltage Over Current (ΔVZ)
100 mV
Maximum Zener Current (IZM)
24.8 mA
Power Dissipation (PD)
500 mW
Reverse Voltage Leakage Current (IR)
1 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Voltage (VZ)
9.5 — 10.5 V

(10 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ58X-1N4697-CT WafflePack@400 Active 10V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPZ28X-1N4678-4717_WPD.PDF Device Datasheet
Material Composition:SOD-123 Material Composition
Package Detail Document:SOD-123 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CPZ19 REPLACED WITH CPZ28 Process Change Notice
Product Reliability Data:SOD-123 Package Reliability Product Reliability Data
Spice Model:Spice Model CMHZ4697 Spice Model