CPZ58X-1N759A

12V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1.5 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Zener Current (IZM)
30 mA
Power Dissipation (PD)
500 mW
Reverse Voltage Leakage Current (IR)
100 nA
Reverse Voltage Leakage Current (IR)
20 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
30 Ω
Zener Voltage (VZ)
11.4 — 12.6 V

(12 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ58X-1N759A-CT WafflePack@400 Active 12V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE
CPZ58X-1N759A-WN Wafer Active 12V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CPZ28X-1N746A-759A_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document

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