CPZ58X-CMPZ5236B

7.5V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

900 mV

Junction Temperature (T_j)

-65 — 150 °C

Maximum Temperature Coefficient (ΘV_Z)

0.058 %/°C

Power Dissipation (P_D)

350 mW

Reverse Voltage Leakage Current (I_R)

3 µA

Storage Temperature (T_stg)

-65 — 150 °C

Zener Impedance (Z_ZT)

6 Ω

Zener Knee Impedance (Z_ZK)

500 Ω

Zener Voltage (V_Z)

7.125 — 7.875 V

(7.5 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ58X-CMPZ5236B-CT	WafflePack@400		Active	7.5V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


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