CPZ59X-1N5259B

Bare die,12.990 X 12.990 mils,Diode-Zener,0.5W Zener Diode

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1.2 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Temperature Coefficient (ΘVZ)
0.094 %/°C
Power Dissipation (PD)
500 mW
Reverse Voltage Leakage Current (IR)
0.1 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
80 Ω
Zener Knee Impedance (ZZK)
800 Ω
Zener Voltage (VZ)
37.05 — 40.95 V

(39 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ59X-1N5259B-CT WafflePack@400 Active Bare die,12.990 X 12.990 mils,Diode-Zener,0.5W Zener Diode EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPZ28X-1N5221B_SERIES_WPD.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:CMPZ5259B Spice Model
Step File 3D Object:SOT-23 Step File 3D Object