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CP226V-2N4391

4V,10V,50mA,1.8W Bare die,20.000 X 17.000 mils,JFET

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
14 pF
Common Source Reverse Transfer Capacitance (Crss)
4 pF
Continuous Gate Current (IG)
50 mA
Drain Current-Off (ID(OFF))
100 pA
Drain Current-Off (ID(OFF))
200 nA
Drain-Gate Voltage (VDG)
40 V
Drain-Source On Resistance (rds(ON))
30 Ω
Drain-Source On Voltage (VDS(ON))
400 mV
Fall Time (tf)
15 ns
Gate Leakage Current (IGSS)
100 pA
Gate Leakage Current (IGSS)
200 nA
Gate-Source Breakdown Voltage (BVGSS)
40 V
Gate-Source Cutoff Voltage (VGS(OFF))
4 — 10 V
Gate-Source Forward Voltage (VGS(f))
1 V
Gate-Source Voltage (VGS)
40 V
Junction Temperature (Tj)
-65 — 175 °C
Power Dissipation (PD)
1.8 W
Rise Time (tr)
5 ns
Saturation Drain Current (IDSS)
50 — 150 mA
Static Drain-Source On Resistance (rDS(ON))
30 Ω
Storage Temperature (Tstg)
-65 — 175 °C
Turn-off Delay Time (tOFF)
20 ns
Turn-on Delay Time (tON)
15 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP226V-2N4391-CM WafflePack@400 Active 4V,10V,50mA,1.8W Bare die,20.000 X 17.000 mils,JFET EAR99 8541.29.0040 PBFREE
CP226V-2N4391-CT WafflePack@400 Active 4V,10V,50mA,1.8W Bare die,20.000 X 17.000 mils,JFET EAR99 8541.29.0040 PBFREE
CP226V-2N4391-CT20 WafflePack@20 Active 4V,10V,50mA,1.8W Bare die,20.000 X 17.000 mils,JFET EAR99 8541.29.0040 PBFREE
CP226V-2N4391-WN Wafer Active 4V,10V,50mA,1.8W Bare die,20.000 X 17.000 mils,JFET EAR99 8541.29.0040 PBFREE

Resources

Item Type
Analytical Test Report:Copper Bonding Wire Analytical Test Report
Analytical Test Report:Epoxy Adhesive Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Free Analytical Test Report
Analytical Test Report:Lead Frame Analytical Test Report
Analytical Test Report:Pure Tin Solder, Sn Analytical Test Report
Analytical Test Report:Tin Plating Analytical Test Report
CP226V-2N4391_WPD.PDF Device Datasheet
Material Composition:TO-92 Material Composition
Package Detail Document:TO-92 Package Detail Document
Process Change Notice:CP216 REPLACES CP206 Process Change Notice
Process Change Notice:CP226 REPLACE CP216 Process Change Notice
Process Change Notice:TO-92 process change eutectic Process Change Notice
Product Brief:PB JFETs Product Brief
Product Reliability Data:TO-92 Package Reliability Product Reliability Data
Spice Model:Spice Model PN4391 Spice Model

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