CP232V-2N4416A
2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 100 MHz
Test Conditions
VDS = 15 V
f = 400 MHz
Test Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 100 MHz
Test Conditions
VDS = 15 V
f = 400 MHz
Test Conditions
VDS = 15 V
ID = 5 mA
f = 100 MHz
Test Conditions
VDS = 15 V
ID = 5 mA
f = 400 MHz
Test Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 1 kHz
Test Conditions
VDS = 15 V
f = 400 MHz
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
TA = 150 °C
Test Conditions
IG = 1 µA
Test Conditions
VDS = 15 V
ID = 1 nA
Test Conditions
VDS = 15 V
f = 100 MHz
Test Conditions
VDS = 15 V
f = 400 MHz
Test Conditions
VDS = 15 V
f = 100 MHz
RG = 1 kΩ
ID = 5 mA
Test Conditions
VDS = 15 V
f = 400 MHz
RG = 1 kΩ
ID = 5 mA
Test Conditions
VDS = 15 V
f = 1 kHz
Test Conditions
VDS = 15 V
f = 100 MHz
Test Conditions
VDS = 15 V
f = 400 MHz
Test Conditions
VDS = 15 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP232V-2N4416A-CM | WafflePack@400 | Active | 2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET | EAR99 | 8541.21.0040 | PBFREE | |
| CP232V-2N4416A-CT | WafflePack@400 | Active | 2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET | EAR99 | 8541.21.0040 | PBFREE | |
| CP232V-2N4416A-CT20 | WafflePack@20 | Special Order Item | 2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET | EAR99 | 8541.21.0040 | PBFREE | |
| CP232V-2N4416A-WN | Wafer | Active | 2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP232V-2N4416A_WPD.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CP210->CP232V | Process Change Notice |
| Product Brief:PB JFETs | Product Brief |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMPF4416A | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
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Design Support
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- Online technical data and parametric search
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- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development