Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
IS = 11.5 mA
Test Conditions
ID = 10 µA
(105 V Typical)
Test Conditions
ID = 500 mA
VGS = 10 V
Test Conditions
ID = 50 mA
VGS = 5 V
Test Conditions
VDS = 10 V
ID = 200 mA
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
Test Conditions
ID = 250 µA
(2.1 V Typical)
Test Conditions
VDS = 30 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 30 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 10 V
VGS = 10 V
Test Conditions
VDS = 60 V
Test Conditions
VDS = 60 V
TA = 125 °C
Test Conditions
ID = 500 mA
VGS = 10 V
(3.7 Ω Typical)
Test Conditions
ID = 500 mA
VGS = 10 V
TA = 100 °C
Test Conditions
ID = 50 mA
VGS = 5 V
(6.2 Ω Typical)
Test Conditions
ID = 50 mA
VGS = 5 V
TA = 100 °C
Test Conditions
VDS = 30 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDD = 30 V
ID = 200 mA
RG = 25 Ω
RL = 150 Ω
Test Conditions
VDD = 30 V
RL = 150 Ω
RG = 25 Ω
ID = 200 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP324-2N7002-CT | WafflePack@400 | Discontinued | 115mA,60V Bare die,21.650 X 21.650 mils,MOSFET | EAR99 | 8541.21.0040 | PBFREE | |
| CP324-2N7002-WN | Wafer | Discontinued | 115mA,60V Bare die,21.650 X 21.650 mils,MOSFET | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP324.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model 2N7002 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
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- Custom bar coding for shipments
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development