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CP328X-7002AE

Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
50 pF
Common Source Output Capacitance (Coss)
25 pF
Common Source Reverse Transfer Capacitance (Crss)
5 pF
Continuous Drain Current (ID)
300 mA
Diode Forward On Voltage (VSD)
0.5 — 1.1 V
Drain-Gate Voltage (VDG)
60 V
Drain-Source Breakdown Voltage (BVDSS)
60 V

(70 V Typical)

Drain-Source Voltage (VDS)
60 V
Forward Transconductance (gFS)
220 mS
Gate Leakage Current, Forward (IGSSF)
10 µA
Gate Leakage Current, Reverse (IGSSR)
10 µA
Gate Threshold Voltage (VGS(th))
1.2 — 2 V

(1.5 V Typical)

Gate-Drain Charge (Qgd)
0.14 nC
Gate-Source Charge (Qgs)
0.2 nC
Gate-Source Voltage (VGS)
20 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current (IDM)
800 mA
Power Dissipation (PD)
350 mW
Saturation Drain Current (IDSS)
100 nA
Saturation Drain Current (IDSS)
500 µA
Static Drain-Source On Resistance (rDS(ON))
1.4 Ω

(1 Ω Typical)

Static Drain-Source On Resistance (rDS(ON))
1.8 Ω

(1.1 Ω Typical)

Static Drain-Source On Resistance (rDS(ON))
6 Ω

(3 Ω Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
0.5 nC
Turn Off Time (toff)
45 ns
Turn On Time (ton)
20 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP328X-7002AE-CM WafflePack@400 Active Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET EAR99 8541.21.0040 PBFREE
CP328X-7002AE-CT WafflePack@400 Active Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET EAR99 8541.21.0040 PBFREE

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CP328X-7002AE_WPD.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPDM7002AE Spice Model
Step File 3D Object:SOT-23 Step File 3D Object