CP343V-CXDM1002N
2A,100V Bare die,55.300 X 55.300 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
IS = 1 A
Test Conditions
ID = 250 µA
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
Test Conditions
ID = 250 µA
(2.1 V Typical)
Test Conditions
VDS = 80 V
VGS = 5 V
ID = 2 A
Test Conditions
VDS = 80 V
VGS = 5 V
ID = 2 A
Test Conditions
VDS = 100 V
Test Conditions
VGS = 10 V
ID = 2 A
(125 mΩ Typical)
Test Conditions
VGS = 4.5 V
ID = 1 A
(140 mΩ Typical)
Test Conditions
VDS = 80 V
VGS = 5 V
ID = 2 A
Test Conditions
VDD = 50 V
ID = 3.5 A
RG = 4.7 Ω
VGS = 5 V
Test Conditions
VDD = 50 V
RG = 4.7 Ω
ID = 3.5 A
VGS = 5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP343V-CXDM1002N-CT | WafflePack@400 | Active | 2A,100V Bare die,55.300 X 55.300 mils,MOSFET | EAR99 | 8541.29.0040 | PBFREE | |
| CP343V-CXDM1002N-WN | Wafer | Active | 2A,100V Bare die,55.300 X 55.300 mils,MOSFET | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:TVS Die | Analytical Test Report |
| Analytical Test Report:Wafer Rectifier | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| Analytical Test Report:Wafer/Die | Analytical Test Report |
| CP343V-CXDM1002N_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
Product Support
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Design Support
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- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development