CP350-CZDM8502N
2A,850V Bare die,85.050 X 110.650 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IS = 2 A
di/dt = 100 A/µs
Test Conditions
IS = 2 A
di/dt = 100 A/µs
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
IS = 2 A
Test Conditions
ID = 250 µA
Test Conditions
VDD = 400 V
VGS = 10 V
ID = 2 A
RG = 25 Ω
Test Conditions
VGS = 30 V
Test Conditions
VGS = 30 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 400 V
VGS = 10 V
ID = 2 A
Test Conditions
VDS = 400 V
VGS = 10 V
ID = 2 A
Test Conditions
VDD = 400 V
VGS = 10 V
ID = 2 A
RG = 25 Ω
Test Conditions
VDS = 850 V
Test Conditions
VGS = 10 V
ID = 1 A
Test Conditions
VDS = 400 V
VGS = 10 V
ID = 2 A
Test Conditions
VDD = 400 V
VGS = 10 V
ID = 2 A
RG = 25 Ω
Test Conditions
VDD = 400 V
VGS = 10 V
ID = 2 A
RG = 25 Ω
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP350-CZDM8502N-CT | WafflePack@100 | Active | 2A,850V Bare die,85.050 X 110.650 mils,MOSFET | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP350-CZDM8502N_WPD.PDF | Device Datasheet |
| Material Composition:SOT-223 | Material Composition |
| Package Detail Document:SOT-223 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-223 | Process Change Notice |
| Process Change Notice:CZDM8502N | Process Change Notice |
| Product EOL Notice:All devices in SOT-223 Case | Product EOL Notice |
| Product Reliability Data:SOT-223 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CZDM8502N | Spice Model |
| Step File 3D Object:SOT-223 | Step File 3D Object |