CP361R-CEDM7001
100mA,20V Bare die,14.173 X 14.173 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 3 V
f = 1 MHz
Test Conditions
VDS = 3 V
f = 1 MHz
Test Conditions
VDS = 3 V
f = 1 MHz
Test Conditions
ID = 100 µA
Test Conditions
VDS = 10 V
ID = 100 mA
Test Conditions
VGS = 10 V
Test Conditions
VGS = 10 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 20 V
Test Conditions
ID = 10 mA
VGS = 4 V
(0.9 Ω Typical)
Test Conditions
ID = 10 mA
VGS = 2.5 V
(1.3 Ω Typical)
Test Conditions
ID = 1 mA
VGS = 1.5 V
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDD = 3 V
ID = 10 mA
VGS = 2.5 V
Test Conditions
VDD = 3 V
ID = 10 mA
VGS = 2.5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP361R-CEDM7001-CT | WafflePack@400 | Active | 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET | EAR99 | 8541.21.0040 | PBFREE | |
| CP361R-CEDM7001-WN | Wafer | Active | 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP361R-CEDM7001_WPD.PDF | Device Datasheet |
| Material Composition:SOT-523 | Material Composition |
| Package Detail Document:SOT-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-523 | Process Change Notice |
| Product EOL Notice:All P/Ns in SOT-523 Case | Product EOL Notice |
| Product Reliability Data:SOT-523 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMUDM7001 | Spice Model |
| Step File 3D Object:SOT-523 (SC-89) | Step File 3D Object |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development