CP361X-CEDM7001
100mA,20V Bare die,14.173 X 14.173 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 3 V
f = 1 MHz
Test Conditions
VDS = 3 V
f = 1 MHz
Test Conditions
VDS = 3 V
f = 1 MHz
Test Conditions
ID = 100 µA
Test Conditions
VDS = 10 V
ID = 100 mA
Test Conditions
VGS = 10 V
Test Conditions
VGS = 10 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDS = 20 V
Test Conditions
ID = 10 mA
VGS = 4 V
(0.9 Ω Typical)
Test Conditions
ID = 10 mA
VGS = 2.5 V
(1.3 Ω Typical)
Test Conditions
ID = 1 mA
VGS = 1.5 V
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 100 mA
Test Conditions
VDD = 3 V
ID = 10 mA
VGS = 2.5 V
Test Conditions
VDD = 3 V
ID = 10 mA
VGS = 2.5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP361X-CEDM7001-CT | WafflePack@400 | Active | 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Ni/Pd/Au plated leadframe | Analytical Test Report |
| CP361X-CEDM7001_WPD.PDF | Device Datasheet |
| Material Composition:SOT-883L | Material Composition |
| Package Detail Document:SOT-883L | Package Detail Document |
| Spice Model:Spice Model CEDM7001 | Spice Model |