CP375-CWDM3011N
11A,30V Bare die,62.000 X 38.000 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
IS = 2.6 A
Test Conditions
ID = 250 µA
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
Test Conditions
ID = 250 µA
(1.8 V Typical)
Test Conditions
VDS = 15 V
VGS = 5 V
ID = 10 A
Test Conditions
VDS = 15 V
VGS = 5 V
ID = 10 A
Test Conditions
VDS = 30 V
Test Conditions
VGS = 10 V
ID = 11 A
(14 mΩ Typical)
Test Conditions
VGS = 4.5 V
ID = 9 A
(18 mΩ Typical)
Test Conditions
VDS = 15 V
VGS = 5 V
ID = 10 A
Test Conditions
VDD = 15 V
VGS = 10 V
ID = 10 A
RG = 0.3 Ω
Test Conditions
VDD = 15 V
VGS = 10 V
ID = 10 A
RG = 0.3 Ω
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP375-CWDM3011N-CT | WafflePack@340 | Discontinued | 11A,30V Bare die,62.000 X 38.000 mils,MOSFET | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Wire | Analytical Test Report |
| CP375_WPD.PDF | Device Datasheet |
| Material Composition:SOIC-8 | Material Composition |
| Package Detail Document:SOIC-8 | Package Detail Document |
| Process Change Notice:CP375->CP406 | Process Change Notice |
| Process Change Notice:SOIC-8 CASE | Process Change Notice |
| Product Reliability Data:SOIC-8 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CWDM3011N | Spice Model |