CP387X-CWDM305N
5.8A,30V Bare die,37.800 X 26.000 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 10 V
f = 1 MHz
(500 pF Typical)
Test Conditions
VDS = 10 V
f = 1 MHz
(52 pF Typical)
Test Conditions
VDS = 10 V
f = 1 MHz
(50 pF Typical)
Test Conditions
ID = 250 µA
Test Conditions
VDS = 5 V
ID = 5.8 A
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
Test Conditions
ID = 250 µA
Test Conditions
VGS = 5 V
ID = 5.8 A
VDD = 15 V
(1.4 nC Typical)
Test Conditions
VGS = 5 V
ID = 5.8 A
VDD = 15 V
(0.9 nC Typical)
Test Conditions
VDS = 30 V
Test Conditions
VGS = 10 V
ID = 2.9 A
(24 mΩ Typical)
Test Conditions
VGS = 5 V
ID = 2.9 A
Test Conditions
VGS = 5 V
ID = 5.8 A
VDD = 15 V
(4.2 nC Typical)
Test Conditions
VDD = 15 V
ID = 5.8 A
RG = 10 Ω
Test Conditions
VDD = 15 V
RG = 10 Ω
ID = 5.8 A
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP387X-CWDM305N-CT | WafflePack@400 | Active | 5.8A,30V Bare die,37.800 X 26.000 mils,MOSFET | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Wire | Analytical Test Report |
| CP387X-CWDM305N_WPD.PDF | Device Datasheet |
| Material Composition:SOIC-8 | Material Composition |
| Package Detail Document:SOIC-8 | Package Detail Document |
| Process Change Notice:CP387X REP. CP376X | Process Change Notice |
| Process Change Notice:SOIC-8 CASE | Process Change Notice |
| Product Reliability Data:SOIC-8 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CWDM305N | Spice Model |