CP405-CZDM0408N

Bare die,45.700 X 31.900 mils,N-Chan Enhancement Mode MOSFET

Case Type: CHIP,WAFFLE

Common Source Input Capacitance (Ciss)
730 pF
Common Source Output Capacitance (Coss)
58 pF
Common Source Reverse Transfer Capacitance (Crss)
64 pF
Continuous Drain Current (ID)
6 A
Diode Forward On Voltage (VSD)
1 V
Drain-Source Breakdown Voltage (BVDSS)
40 V
Drain-Source Voltage (VDS)
40 V
Gate Leakage Current, Forward (IGSSF)
100 nA
Gate Leakage Current, Reverse (IGSSR)
100 nA
Gate Threshold Voltage (VGS(th))
1 — 3 V

(1.7 V Typical)

Gate-Drain Charge (Qgd)
2.2 nC
Gate-Source Charge (Qgs)
2 nC
Gate-Source Voltage (VGS)
20 V
Junction Temperature (Tj)
-55 — 150 °C
Maximum Pulsed Drain Current (IDM)
20 A
Power Dissipation (PD)
1.2 W
Saturation Drain Current (IDSS)
1 µA
Static Drain-Source On Resistance (rDS(ON))
31 mΩ

(20 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
45 mΩ

(30 mΩ Typical)

Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
104 °C/W
Total Gate Charge (Qg)
12 nC
Turn Off Time (toff)
33 ns
Turn On Time (ton)
27 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP405-CZDM0408N-CT WafflePack@400 Active Bare die,45.700 X 31.900 mils,N-Chan Enhancement Mode MOSFET EAR99 8541.29.0040 PBFREE
CP405-CZDM0408N-WN Wafer Active Bare die,45.700 X 31.900 mils,N-Chan Enhancement Mode MOSFET EAR99 8541.29.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CP405-CZDM0408N_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development