CP726X-CMLDM8120
860mA,20V Bare die,27.559 X 31.496 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
VDS = 16 V
f = 1 MHz
Test Conditions
IS = 360 mA
Test Conditions
ID = 250 µA
(24 V Typical)
Test Conditions
VDS = 10 V
ID = 810 mA
Test Conditions
VGS = 8 V
(1 nA Typical)
Test Conditions
VGS = 8 V
(1 nA Typical)
Test Conditions
ID = 250 µA
(0.76 V Typical)
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDS = 20 V
(5 nA Typical)
Test Conditions
ID = 950 mA
VGS = 4.5 V
(85 mΩ Typical)
Test Conditions
ID = 770 mA
VGS = 4.5 V
(85 mΩ Typical)
Test Conditions
ID = 670 mA
VGS = 2.5 V
(130 mΩ Typical)
Test Conditions
ID = 200 mA
VGS = 1.8 V
(190 mΩ Typical)
Test Conditions
VDS = 10 V
VGS = 4.5 V
ID = 1 A
Test Conditions
VDD = 10 V
RG = 6 Ω
ID = 950 mA
VGS = 4.5 V
Test Conditions
VDD = 10 V
RG = 6 Ω
ID = 950 mA
VGS = 4.5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP726X-CMLDM8120-CT | WafflePack@400 | Active | 860mA,20V Bare die,27.559 X 31.496 mils,MOSFET | EAR99 | 8541.21.0040 | PBFREE |