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CP764R-8002A

Bare die,21.654 X 17.717 mils,P-Chan Enhancement Mode MOSFET

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
70 pF
Common Source Output Capacitance (Coss)
15 pF
Common Source Reverse Transfer Capacitance (Crss)
7 pF
Continuous Drain Current (ID)
280 mA
Continuous Source Current (Body Diode) (IS)
280 mA
Diode Forward On Voltage (VSD)
1.3 V
Drain-Gate Voltage (VDG)
50 V
Drain-Source Breakdown Voltage (BVDSS)
50 V
Drain-Source On Voltage (VDS(ON))
1.5 V
Drain-Source On Voltage (VDS(ON))
150 mV
Drain-Source Voltage (VDS)
50 V
Forward Transconductance (gFS)
200 mS
Gate Leakage Current, Forward (IGSSF)
100 nA
Gate Leakage Current, Reverse (IGSSR)
100 nA
Gate Threshold Voltage (VGS(th))
1 — 2.5 V
Gate-Drain Charge (Qgd)
0.16 nC
Gate-Source Charge (Qgs)
0.25 nC
Gate-Source Voltage (VGS)
20 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current (IDM)
1.5 A
Maximum Pulsed Source Current (ISM)
1.5 A
On State Drain Current (ID(ON))
500 mA
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
150 mW
Saturation Drain Current (IDSS)
1 µA
Saturation Drain Current (IDSS)
500 µA
Static Drain-Source On Resistance (rDS(ON))
2.5 Ω
Static Drain-Source On Resistance (rDS(ON))
4 Ω
Static Drain-Source On Resistance (rDS(ON))
3 Ω
Static Drain-Source On Resistance (rDS(ON))
5 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
0.72 nC
Turn Off Time (toff)
20 ns
Turn On Time (ton)
20 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP764R-8002A-CT WafflePack@400 Active Bare die,21.654 X 17.717 mils,P-Chan Enhancement Mode MOSFET EAR99 8541.21.0040 PBFREE
CP764R-8002A-WN Wafer Active Bare die,21.654 X 17.717 mils,P-Chan Enhancement Mode MOSFET EAR99 8541.21.0040 PBFREE

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CP764R-8002A_WPD.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SMD MOSFET Halogen Free Mold Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:Spice Model CMLDM8002A Spice Model

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