CP773-CMPDM302PH
2.4A,30V Bare die,27.000 X 39.000 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
ID = 250 µA
Test Conditions
VDS = 5 V
ID = 2.4 A
Test Conditions
VGS = 12 V
Test Conditions
VGS = 12 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
VGS = 5 V
ID = 2.4 A
(1.5 nC Typical)
Test Conditions
VDS = 10 V
VGS = 5 V
ID = 2.4 A
(1.4 nC Typical)
Test Conditions
VDS = 20 V
Test Conditions
VGS = 4.5 V
ID = 1.2 A
(0.05 Ω Typical)
Test Conditions
VGS = 2.5 V
ID = 1.2 A
(0.066 Ω Typical)
Test Conditions
VDS = 10 V
VGS = 5 V
ID = 2.4 A
(7 nC Typical)
Test Conditions
VDD = 10 V
ID = 2.4 A
RG = 10 Ω
Test Conditions
VDD = 10 V
RG = 10 Ω
ID = 2.4 A
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP773-CMPDM302PH-CT | WafflePack@400 | Discontinued | 2.4A,30V Bare die,27.000 X 39.000 mils,MOSFET | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| CP773-CMPDM302PH_WPD.PDF | Device Datasheet |
| Material Composition:SOT-23F | Material Composition |
| Package Detail Document:SOT-23F | Package Detail Document |
| Product EOL Notice:CMPDM202PH | Product EOL Notice |
| Spice Model:Spice Model CMPDM302PH | Spice Model |