CP776-CWDM305P
5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 10 V
f = 1 MHz
(500 pF Typical)
Test Conditions
VDS = 10 V
f = 1 MHz
(60 pF Typical)
Test Conditions
VDS = 10 V
f = 1 MHz
(50 pF Typical)
Test Conditions
ID = 250 µA
Test Conditions
VDS = 5 V
ID = 5.3 A
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 15 V
VGS = 5 V
ID = 5.3 A
(1.7 nC Typical)
Test Conditions
VDS = 15 V
VGS = 5 V
ID = 5.3 A
(1.4 nC Typical)
Test Conditions
VDS = 30 V
Test Conditions
VGS = 10 V
ID = 2.7 A
(66 mΩ Typical)
Test Conditions
VGS = 5 V
ID = 2.7 A
(77 mΩ Typical)
Test Conditions
VDS = 15 V
VGS = 5 V
ID = 5.3 A
(4.7 nC Typical)
Test Conditions
VDD = 15 V
ID = 5.3 A
RG = 10 Ω
Test Conditions
VDD = 15 V
RG = 10 Ω
ID = 5.3 A
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP776-CWDM305P-CM | WafflePack@400 | Active | 5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET | EAR99 | 8541.29.0040 | PBFREE | |
| CP776-CWDM305P-CM20 | WafflePack@20 | Special Order Item | 5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET | EAR99 | 8541.29.0040 | PBFREE | |
| CP776-CWDM305P-CT | WafflePack@400 | Active | 5.3A,30V Bare die,33.070 X 23.620 mils,MOSFET | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Wire | Analytical Test Report |
| CP776-CWDM305P_WPD.PDF | Device Datasheet |
| Material Composition:SOIC-8 | Material Composition |
| Package Detail Document:SOIC-8 | Package Detail Document |
| Process Change Notice:SOIC-8 CASE | Process Change Notice |
| Product Reliability Data:SOIC-8 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CWDM305P | Spice Model |