CP798X-CPDM302PH
Bare die,37.800 X 26.000 mils,P-Chan Enhancement Mode MOSFET
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
VDS = 10 V
f = 1 MHz
Test Conditions
ID = 250 µA
Test Conditions
VDS = 5 V
ID = 2.4 A
Test Conditions
VGS = 12 V
Test Conditions
VGS = 12 V
Test Conditions
ID = 250 µA
Test Conditions
VDS = 10 V
VGS = 5 V
ID = 2.4 A
(1.5 nC Typical)
Test Conditions
VDS = 10 V
VGS = 5 V
ID = 2.4 A
(1.4 nC Typical)
Test Conditions
VDS = 20 V
Test Conditions
VGS = 4.5 V
ID = 1.2 A
(0.05 Ω Typical)
Test Conditions
VGS = 2.5 V
ID = 1.2 A
(0.066 Ω Typical)
Test Conditions
VDS = 10 V
VGS = 5 V
ID = 2.4 A
(7 nC Typical)
Test Conditions
VDD = 10 V
ID = 2.4 A
RG = 10 Ω
Test Conditions
VDD = 10 V
RG = 10 Ω
ID = 2.4 A
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP798X-CPDM302PH-CT | WafflePack@400 | Special Order Item | Bare die,37.800 X 26.000 mils,P-Chan Enhancement Mode MOSFET | EAR99 | 8541.21.0040 | PBFREE | |
| CP798X-CPDM302PH-WN | Wafer | Special Order Item | Bare die,37.800 X 26.000 mils,P-Chan Enhancement Mode MOSFET | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:TVS Die | Analytical Test Report |
| Analytical Test Report:Wafer Rectifier | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| Analytical Test Report:Wafer/Die | Analytical Test Report |
| CP798X-CPDM302PH_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Process Change Notice:CP798X REP. CP773 | Process Change Notice |
| Product EOL Notice:CP773 to CP798X | Product EOL Notice |
| Spice Model:Spice Model CMPDM302PH | Spice Model |
| Spice Model:Spice Model CP773 | Spice Model |
Product Support
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Design Support
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