CP622-2N6027
40V,150mA Bare die,27.560 X 27.560 mils,Programmable UJT
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 50 mA
Test Conditions
VS = 40 V
Test Conditions
VS = 40 V
Test Conditions
VS = 10 V
RG = 1 MΩ
Test Conditions
VS = 10 V
RG = 10 kΩ
Test Conditions
VS = 10 V
RG = 1 MΩ
Test Conditions
VS = 10 V
RG = 10 kΩ
Test Conditions
VB = 20 V
CC = 0.2 µF
Test Conditions
VB = 20 V
CC = 0.2 µF
Test Conditions
VS = 10 V
RG = 1 MΩ
Test Conditions
VS = 10 V
RG = 10 kΩ
Test Conditions
VS = 10 V
RG = 200 Ω
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP622-2N6027-CT | WafflePack@400 | Active | 40V,150mA Bare die,27.560 X 27.560 mils,Programmable UJT | EAR99 | 8541.21.0040 | PBFREE | |
| CP622-2N6027-CT20 | WafflePack@20 | Active | 40V,150mA Bare die,27.560 X 27.560 mils,Programmable UJT | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
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| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP622-2N6027_WPD.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |