Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
ITM = 1.2 A
Test Conditions
VD = 7 V
RGK = 1 kΩ
RL = 100 Ω
Test Conditions
VD = 7 V
RGK = 1 kΩ
RL = 100 Ω
TC = -65 °C
Test Conditions
VD = 7 V
RL = 100 Ω
Test Conditions
VD = 7 V
RL = 100 Ω
TC = -65 °C
Test Conditions
VD = 7 V
RL = 100 Ω
TC = 125 °C
Test Conditions
RGK = 1 kΩ
Test Conditions
RGK = 1 kΩ
TC = -65 °C
Test Conditions
VDRM = 30 V
RGK = 1 kΩ
Test Conditions
VDRM = 30 V
RGK = 1 kΩ
TC = 125 °C
Test Conditions
VD = 20 V
RGK = 1 kΩ
TC = 125 °C
Test Conditions
VRRM = 30 V
RGK = 1 kΩ
Test Conditions
VRRM = 30 V
RGK = 1 kΩ
TC = 125 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPS041-2N5060-CT | WafflePack@400 | Discontinued | .8A,30V Bare die,41.340 X 41.340 mils,SCR | EAR99 | 8541.30.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CPS041.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Product EOL Notice:CPS041 CHIP PROCESS | Product EOL Notice |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development