Home / Products / Die Solutions / Thyristors / SCR / CPS053-CS18B

CPS053-CS18B

1A,200V Bare die,53.150 X 53.150 mils,SCR

Case Type: CHIP,WAFFLE

Back to Top Specifications Ordering Resources Support

Technical Specifications

Similar Products with Selected Specifications
Average Gate Power (PG(AV))
0.1 W
Forward Voltage (VTM)
2.15 V

(1.6 V Typical)

Gate Trigger Current (IGT)
200 µA

(20 µA Typical)

Gate Trigger Voltage (VGT)
0.8 V

(0.65 V Typical)

Holding Current (IH)
5 mA
Junction Temperature (Tj)
-40 — 125 °C
Peak Forward Gate Current (IFGM)
1 A
Peak Gate Power (PGM)
2 W
Peak Off-State Blocking Current (IDRM)
1 µA
Peak Off-State Blocking Current (IDRM)
100 µA
Peak One Cycle Surge Current (ITSM)
10 A
Peak Repetitive Off-State Voltage (VDRM)
200 V
Peak Repetitive Reverse Voltage (VRRM)
200 V
Rate of Rise of Reverse Voltage (dv/dt)
25 V/µs
RMS On-State Current (IT(RMS))
1 A
Storage Temperature (Tstg)
-40 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
200 °C/W
Thermal Resistance Junction-Case (ΘJC)
32 °C/W
ueak Reverse Blocking Current (IRRM)
1 µA
ueak Reverse Blocking Current (IRRM)
100 µA
Value For Fusing (I²T)
0.24 A2s

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPS053-CS18B-CT WafflePack@400 Active 1A,200V Bare die,53.150 X 53.150 mils,SCR EAR99 8541.30.0040 PBFREE
CPS053-CS18B-WN Wafer Active 1A,200V Bare die,53.150 X 53.150 mils,SCR EAR99 8541.30.0040 PBFREE

Resources

Item Type
Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CPS053.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document

Product Support

Contact Product Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

Design Support

Contact Design Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development