CP101-BSS52
1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 150 mA
VCE = 10 V
Test Conditions
IC = 500 mA
VCE = 10 V
Test Conditions
IC = 500 mA
IB = 500 µA
Test Conditions
IC = 1 A
IB = 4 mA
Test Conditions
VCB = 80 V
Test Conditions
IC = 500 mA
IB = 500 µA
Test Conditions
IC = 500 mA
IB = 500 µA
TA = 200 °C
Test Conditions
IC = 1 A
IB = 4 mA
Test Conditions
IC = 1 A
IB = 4 mA
TA = 200 °C
Test Conditions
VCE = 10 V
IC = 150 mA
Test Conditions
VCE = 10 V
IC = 500 mA
Test Conditions
VEB = 4 V
Test Conditions
VCE = 5 V
IC = 500 mA
f = 35 MHz
Test Conditions
VCC = 10 V
IC = 500 mA
IB1 = 500 µA
IB2 = 500 µA
Test Conditions
VCC = 10 V
IC = 1 A
IB1 = 1 mA
IB2 = 1 mA
Test Conditions
VCC = 10 V
IC = 500 mA
IB1 = 500 µA
Test Conditions
VCC = 10 V
IC = 1 A
IB1 = 1 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP101-BSS52-CT | WafflePack@400 | Discontinued | 1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE | |
| CP101-BSS52-CT20 | WafflePack@20 | Discontinued | 1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CP101-BSS52_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Product EOL Notice:CP101 wafer process | Product EOL Notice |