CP307-2N5308

300mA,40V Bare die,27.170 X 27.170 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

Base-Emitter On Voltage (VBE(ON))
1.5 V
Base-Emitter Saturation Voltage (VBE(SAT))
1.6 V
Collector-Base Breakdown Voltage (BVCBO)
40 V
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Cutoff Current (ICBO)
20 µA
Collector-Base Voltage (VCBO)
40 V
Collector-Emitter Breakdown Voltage (BVCEO)
40 V
Collector-Emitter Saturation Voltage (VCE(SAT))
1.4 V
Collector-Emitter Voltage (VCEO)
40 V
Continuous Base Current (IB)
50 mA
Continuous Collector Current (IC)
300 mA
Current Gain-Bandwidth Product (fT)
60 MHz
DC Current Gain (hFE)
7 — 70 x103
DC Current Gain (hFE)
20 x103
Emitter-Base Breakdown Voltage (BVEBO)
12 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
12 V
Input Capacitance (Cib)
12 pF
Input Impedance Common Emitter (hie)
650 kΩ
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
10 pF
Peak Collector Current (ICM)
500 mA
Power Dissipation (PD)
625 mW
Power Dissipation (PD)
1.5 W
Small Signal Current Gain (hfe)
7 x103
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
200 °C/W
Thermal Resistance Junction-Case (ΘJC)
83.3 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP307-2N5308-CT WafflePack@400 Discontinued 300mA,40V Bare die,27.170 X 27.170 mils,Transistor-Small Signal (<=1A) EAR99 8541.29.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CP307.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document
Process Change Notice:CP327V replacing CP307V Process Change Notice
Process Change Notice:WAFER THICKNESS REDUCTION Process Change Notice
Product EOL Notice:CP3O7,V TO CP327V Product EOL Notice

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