CP327V-2N5308
300mA,40V Bare die,22.835 X 22.835 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 200 mA
VCE = 5 V
Test Conditions
IC = 200 mA
IB = 200 µA
Test Conditions
IC = 100 nA
Test Conditions
VCB = 40 V
Test Conditions
VCB = 40 V
TA = 100 °C
Test Conditions
IC = 10 mA
Test Conditions
IC = 200 mA
IB = 200 µA
Test Conditions
VCE = 5 V
IC = 2 mA
f = 10 MHz
Test Conditions
VCE = 5 V
IC = 2 mA
Test Conditions
VCE = 5 V
IC = 100 mA
Test Conditions
IE = 100 nA
Test Conditions
VEB = 12 V
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 2 mA
f = 1 kHz
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 2 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP327V-2N5308-CT | WafflePack@400 | Active | 300mA,40V Bare die,22.835 X 22.835 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
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| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| CP327V-2N5308_WPD.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:CP327V replacing CP307V | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |