CP329-MPSA29
500mA,100V Bare die,26.772 X 26.772 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 5 V
Test Conditions
IC = 100 µA
Test Conditions
VCB = 80 V
Test Conditions
IC = 100 µA
Test Conditions
VCE = 80 V
Test Conditions
IC = 100 mA
IB = 100 µA
Test Conditions
IC = 10 mA
IB = 10 µA
Test Conditions
VCE = 5 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
VCE = 5 V
IC = 100 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 10 V
Test Conditions
VCB = 10 V
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP329-MPSA29-CT | WafflePack@400 | Active | 500mA,100V Bare die,26.772 X 26.772 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
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| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP329-MPSA29_WPD.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Small Signal Transistor | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMPTA29 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |