CP527-2N6299
8A,80V Bare die,110.000 X 110.000 mils,Transistor-Bipolar Power (>1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 4 A
VCE = 3 V
Test Conditions
IC = 8 A
IB = 80 mA
Test Conditions
IC = 100 mA
Test Conditions
VCE = 80 V
VBE(OFF) = 1.5 V
Test Conditions
VCE = 80 V
VBE(OFF) = 1.5 V
TC = 150 °C
Test Conditions
VCE = 40 V
Test Conditions
IC = 4 A
IB = 16 mA
Test Conditions
IC = 8 A
IB = 80 mA
Test Conditions
VCE = 3 V
IC = 3 A
f = 1 MHz
Test Conditions
VCE = 3 V
IC = 4 A
Test Conditions
VCE = 3 V
IC = 8 A
Test Conditions
VEB = 5 V
Test Conditions
VCB = 10 V
f = 100 kHz
Test Conditions
VCE = 3 V
IC = 3 A
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP527-2N6299-CT | WafflePack@100 | Active | 8A,80V Bare die,110.000 X 110.000 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP527-2N6299-CT5 | WafflePack@5 | Special Order Item | 8A,80V Bare die,110.000 X 110.000 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Leads | Analytical Test Report |
| CP527-2N6299_WPD.PDF | Device Datasheet |
| Material Composition:TO-66 | Material Composition |
| Package Detail Document:TO-66 | Package Detail Document |
| Process Change Notice:CP517 replaced by CP527 | Process Change Notice |
| Product Reliability Data:TO-66 Package Reliablity | Product Reliability Data |
| Spice Model:Spice Model 2N6299 | Spice Model |