CP707-MPSU95
Bare die,27.170 X 27.170 mils,Small Signal Darlington
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 5 V
Test Conditions
VCB = 30 V
Test Conditions
IC = 100 µA
Test Conditions
IC = 100 mA
IB = 100 µA
Test Conditions
VCE = 5 V
IC = 100 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
VCE = 5 V
IC = 100 mA
Test Conditions
VEB = 10 V
Test Conditions
VCE = 5 V
IC = 1 mA
f = 1 kHz
RS = 100 kΩ
Test Conditions
VCB = 10 V
f = 100 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP707-MPSU95-CT | WafflePack@400 | Discontinued | Bare die,27.170 X 27.170 mils,Small Signal Darlington | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CP707.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Process Change Notice:CP707 replaced by CP727V | Process Change Notice |
| Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS | Product EOL Notice |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
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- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development