CP727V-CZTA77

500mA,60V Bare die,22.800 X 22.800 mils,Transistor-Small Signal (<=1A)

Case Type: CHIP,WAFFLE

Base-Emitter On Voltage (V_BE(ON))

2 V

Collector-Base Breakdown Voltage (BV_CBO)

60 V

Collector-Base Cutoff Current (I_CBO)

100 nA

Collector-Emitter Breakdown Voltage (BV_CES)

60 V

Collector-Emitter Cutoff Current (I_CES)

500 nA

Collector-Emitter Saturation Voltage (V_CE(SAT))

1.5 V

Collector-Emitter Voltage (V_CES)

60 V

Continuous Collector Current (I_C)

500 mA

Current Gain-Bandwidth Product (f_T)

125 MHz

DC Current Gain (h_FE)

10 x10³

DC Current Gain (h_FE)

10 x10³

Emitter-Base Cutoff Current (I_EBO)

100 nA

Emitter-Base Voltage (V_EBO)

10 V

Junction Temperature (T_j)

-65 — 150 °C

Power Dissipation (P_D)

2 W

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Ambient (Θ_JA)

62.5 °C/W

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CP727V-CZTA77-CT	WafflePack@400		Active	500mA,60V Bare die,22.800 X 22.800 mils,Transistor-Small Signal (<=1A)	EAR99	8541.21.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Copper Bond Wire	Analytical Test Report
Analytical Test Report:Gold Bond Wire	Analytical Test Report
Analytical Test Report:Lead frame	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CP727V-CZTA77_WPD.PDF	Device Datasheet
Material Composition:SOT-223	Material Composition
Package Detail Document:SOT-223	Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-223	Process Change Notice
Process Change Notice:CP707 replaced by CP727V	Process Change Notice
Product Reliability Data:SOT-223 Package Reliability	Product Reliability Data
Spice Model:Spice Model CZTA77	Spice Model
Step File 3D Object:SOT-223	Step File 3D Object