CP727V-MPSA64
500mA,30V Bare die,22.800 X 22.800 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 5 V
Test Conditions
VCB = 30 V
Test Conditions
IC = 100 µA
Test Conditions
IC = 100 mA
IB = 100 µA
Test Conditions
VCE = 5 V
IC = 100 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
VCE = 5 V
IC = 100 mA
Test Conditions
VEB = 10 V
Test Conditions
VCE = 5 V
IC = 1 mA
f = 1 kHz
RS = 100 kΩ
Test Conditions
VCB = 10 V
f = 100 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP727V-MPSA64-CM | WafflePack@400 | Active | 500mA,30V Bare die,22.800 X 22.800 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| CP727V-MPSA64_WPD.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:CP707 replaced by CP727V | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |