CP727V-MPSA64
500mA,30V Bare die,22.800 X 22.800 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 5 V
Test Conditions
VCB = 30 V
Test Conditions
IC = 100 µA
Test Conditions
IC = 100 mA
IB = 100 µA
Test Conditions
VCE = 5 V
IC = 100 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
VCE = 5 V
IC = 100 mA
Test Conditions
VEB = 10 V
Test Conditions
VCE = 5 V
IC = 1 mA
f = 1 kHz
RS = 100 kΩ
Test Conditions
VCB = 10 V
f = 100 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP727V-MPSA64-CM | WafflePack@400 | Active | 500mA,30V Bare die,22.800 X 22.800 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| Analytical Test Report:Wafer Zener | Analytical Test Report |
| Analytical Test Report:Wafer/Die | Analytical Test Report |
| CP727V-MPSA64_WPD.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |