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CP188-2N2920
60V,30mA,300mW Bare die,14.568 X 14.568 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 µA
VCE = 5 V
Test Conditions
VCE = 5 V
IC = 10 µA
Test Conditions
VCE = 5 V
IC = 100 µA
Test Conditions
VCE = 5 V
IC = 1 mA
Test Conditions
VCE = 5 V
IC = 100 µA
T1 = -55 °C
T2 = 25 °C
Test Conditions
VCE = 5 V
IC = 100 µA
T1 = 25 °C
T2 = 125 °C
Test Conditions
IC = 10 µA
Test Conditions
VCB = 45 V
Test Conditions
VCB = 45 V
TA = 150 °C
Test Conditions
IC = 10 mA
Test Conditions
VCE = 5 V
Test Conditions
IC = 1 mA
IB = 100 µA
Test Conditions
VCE = 5 V
IC = 500 µA
f = 20 MHz
Test Conditions
VCE = 5 V
IC = 10 µA
Test Conditions
VCE = 5 V
IC = 10 µA
TA = -55 °C
Test Conditions
VCE = 5 V
IC = 100 µA
Test Conditions
VCE = 5 V
IC = 1 mA
Test Conditions
VCE = 5 V
IC = 100 µA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 5 V
Test Conditions
VCB = 5 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCE = 5 V
IC = 10 µA
BW = 200 Hz
f = 1 kHz
RS = 10 kΩ
Test Conditions
VCE = 5 V
IC = 10 µA
BW = 15.7 Hz
f = 10 kHz
RS = 10 kΩ
Test Conditions
VCB = 5 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCB = 5 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP188-2N2920-CTJ | WafflePack@280 | Discontinued | 60V,30mA,300mW Bare die,14.568 X 14.568 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CP188.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Process Change Notice:CP188 and CP588 replaced by | Process Change Notice |
| Process Change Notice:WAFER THICKNESS REDUCTION | Process Change Notice |
| Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS | Product EOL Notice |