CP191V-2N2219A
40V,800mA,800mW Bare die,16.535 X 16.535 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
IC = 10 µA
Test Conditions
VCB = 60 V
Test Conditions
IC = 10 mA
Test Conditions
VCE = 60 V
VBE(OFF) = 3 V
Test Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
IC = 20 mA
VCE = 20 V
Test Conditions
VCE = 10 V
IC = 100 µA
Test Conditions
VCE = 10 V
IC = 1 mA
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 150 mA
Test Conditions
VCE = 1 V
IC = 150 mA
Test Conditions
VCE = 10 V
IC = 500 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 3 V
Test Conditions
VCB = 10 V
f = 100 kHz
Test Conditions
IC = 150 mA
IB1 = 15 mA
VCC = 30 V
IB2 = 15 mA
Test Conditions
IC = 150 mA
VCC = 30 V
IB = 15 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP191V-2N2219A-CT | WafflePack@400 | Active | 40V,800mA,800mW Bare die,16.535 X 16.535 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| CP191V.PDF | Device Datasheet |
| Material Composition:TO-39 | Material Composition |
| Package Detail Document:TO-39 | Package Detail Document |
| Product Reliability Data:TO-39 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model 2N2219A | Spice Model |