CP219-2N5338
100V,5A,6W Bare die,82.690 X 82.690 mils,Transistor-Bipolar Power (>1A)
Case Type: WAFER
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 2 A
IB = 200 mA
Test Conditions
IC = 5 A
IB = 500 mA
Test Conditions
VCB = 100 V
Test Conditions
IC = 50 mA
Test Conditions
VCE = 90 V
VBE(OFF) = 1.5 V
Test Conditions
VCE = 90 V
VBE(OFF) = 1.5 V
TC = 150 °C
Test Conditions
VCE = 90 V
Test Conditions
IC = 2 A
IB = 200 mA
Test Conditions
IC = 5 A
IB = 500 mA
Test Conditions
VCE = 10 V
IC = 500 mA
f = 10 MHz
Test Conditions
VCE = 2 V
IC = 500 mA
Test Conditions
VCE = 2 V
IC = 2 A
Test Conditions
VCE = 2 V
IC = 5 A
Test Conditions
VEB = 6 V
Test Conditions
VCC = 40 V
IC = 2 A
IB1 = 200 mA
IB2 = 200 mA
Test Conditions
VEB = 2 V
Test Conditions
VEB = 2 V
f = 100 kHz
Test Conditions
VCB = 10 V
f = 100 kHz
Test Conditions
VCC = 40 V
IC = 2 A
IB1 = 200 mA
IB2 = 200 mA
Test Conditions
VCC = 40 V
IC = 2 A
IB1 = 200 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP219-2N5338-WN | Wafer | Discontinued | 100V,5A,6W Bare die,82.690 X 82.690 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP219-2N5338_WPD.PDF | Device Datasheet |
| Material Composition:SOT-223 | Material Composition |
| Package Detail Document:SOT-223 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-223 | Process Change Notice |
| Product EOL Notice:All devices in SOT-223 Case | Product EOL Notice |
| Product Reliability Data:SOT-223 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CZT5338 | Spice Model |
| Step File 3D Object:SOT-223 | Step File 3D Object |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development