CP229-2N5109
20V,400mA,1W Bare die,21.651 X 21.651 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
f = 200 MHz
VCE = 15 V
IC = 50 mA
Test Conditions
IC = 100 µA
Test Conditions
IC = 5 mA
RBE = 10 Ω
Test Conditions
IC = 5 mA
Test Conditions
VCE = 35 V
VBE(OFF) = 1.5 V
Test Conditions
VCE = 15 V
VBE(OFF) = 1.5 V
TC = 150 °C
Test Conditions
VCE = 15 V
Test Conditions
IC = 100 mA
IB = 10 mA
Test Conditions
VCE = 15 V
IC = 50 mA
f = 200 MHz
Test Conditions
VCE = 15 V
IC = 50 mA
Test Conditions
VCE = 5 V
IC = 360 mA
Test Conditions
VEB = 3 V
Test Conditions
VCE = 15 V
IC = 10 mA
f = 200 MHz
Test Conditions
VCB = 15 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP229-2N5109-CM | WafflePack@400 | Discontinued | 20V,400mA,1W Bare die,21.651 X 21.651 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP229-2N5109-CT | WafflePack@400 | Discontinued | 20V,400mA,1W Bare die,21.651 X 21.651 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| CP229-2N5109_WPD.PDF | Device Datasheet |
| Material Composition:TO-39 | Material Composition |
| Package Detail Document:TO-39 | Package Detail Document |
| Process Change Notice:CP214 Replaced by CP229 | Process Change Notice |
| Product EOL Notice:RF TRANSISTOR DIE | Product EOL Notice |
| Product Reliability Data:TO-39 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model 2N5109 | Spice Model |