CP245-MJE15030
150V,8A,2W Bare die,145.000 X 120.000 mils,Transistor-Bipolar Power (>1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 1 A
VCE = 2 V
Test Conditions
VCB = 150 V
Test Conditions
IC = 10 mA
Test Conditions
VCE = 150 V
Test Conditions
IC = 1 A
IB = 100 mA
Test Conditions
VCE = 10 V
IC = 500 mA
f = 10 MHz
Test Conditions
VCE = 2 V
IC = 100 mA
Test Conditions
VCE = 2 V
IC = 2 A
Test Conditions
VCE = 2 V
IC = 3 A
Test Conditions
VCE = 2 V
IC = 4 A
Test Conditions
VEB = 5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP245-MJE15030-CM | WafflePack@100 | Discontinued | 150V,8A,2W Bare die,145.000 X 120.000 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP245-MJE15030-CT | WafflePack@100 | Discontinued | 150V,8A,2W Bare die,145.000 X 120.000 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP245-MJE15030-WN | Wafer | Discontinued, Stock Only | 150V,8A,2W Bare die,145.000 X 120.000 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| CP245-MJE15030_WPD.PDF | Device Datasheet |
| Material Composition:TO-220 | Material Composition |
| Package Detail Document:TO-220 | Package Detail Document |
| Product EOL Notice:Power transistors bare die and | Product EOL Notice |
| Product Reliability Data:TO-220 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model MJE15030 | Spice Model |
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