CP250-CZTUX87
450V,500mA,2W Bare die,99.285 X 68.853 mils,Transistor-Small Signal (<=1A)
Case Type: WAFER
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 200 mA
IB = 20 mA
Test Conditions
IC = 30 mA
Test Conditions
VCE = 900 V
VBE(OFF) = 1.5 V
Test Conditions
VCE = 900 V
VBE(OFF) = 1.5 V
TA = 125 °C
Test Conditions
IC = 100 mA
IB = 10 mA
Test Conditions
IC = 200 mA
IB = 20 mA
Test Conditions
VCE = 10 V
IC = 50 mA
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 40 mA
Test Conditions
VEB = 5 V
Test Conditions
VCC = 250 V
IC = 200 mA
IB1 = 40 mA
IB2 = 80 mA
Test Conditions
VCC = 250 V
IC = 200 mA
IB1 = 40 mA
IB2 = 80 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP250-CZTUX87-WN | Wafer | Discontinued | 450V,500mA,2W Bare die,99.285 X 68.853 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP250.PDF | Device Datasheet |
| Material Composition:SOT-223 | Material Composition |
| Package Detail Document:SOT-223 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-223 | Process Change Notice |
| Product EOL Notice:CP250-CZTUX87 | Product EOL Notice |
| Product Reliability Data:SOT-223 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CZTUX87 | Spice Model |
| Step File 3D Object:SOT-223 | Step File 3D Object |
Product Support
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- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development