CP304X-MPSA05
60V,500mA,625mW Bare die,22.050 X 22.050 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 1 V
Test Conditions
VCB = 60 V
Test Conditions
IC = 1 mA
Test Conditions
VCE = 60 V
Test Conditions
IC = 100 mA
IB = 10 mA
Test Conditions
VCE = 2 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 1 V
IC = 10 mA
Test Conditions
VCE = 1 V
IC = 100 mA
Test Conditions
IE = 100 µA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP304X-MPSA05-CT | WafflePack@400 | Active | 60V,500mA,625mW Bare die,22.050 X 22.050 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE | |
| CP304X-MPSA05-WN | Wafer | Active | 60V,500mA,625mW Bare die,22.050 X 22.050 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
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| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| CP304X-MPSA05_WPD.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
Product Support
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Design Support
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