CP305V-D40D11
75V,1A,6.25W Bare die,31.100 X 31.100 mils,Transistor-Bipolar Power (>1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
IC = 10 mA
Test Conditions
VCE = 90 V
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
VCE = 2 V
IC = 100 mA
Test Conditions
VCE = 2 V
IC = 1 A
Test Conditions
VEB = 5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP305V-D40D11-CM | WafflePack@400 | Active | 75V,1A,6.25W Bare die,31.100 X 31.100 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.21.0040 | PBFREE | |
| CP305V-D40D11-CM200 | WafflePack@200 | Special Order Item | 75V,1A,6.25W Bare die,31.100 X 31.100 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.21.0040 | PBFREE | |
| CP305V-D40D11-CT | WafflePack@400 | Active | 75V,1A,6.25W Bare die,31.100 X 31.100 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.21.0040 | PBFREE | |
| CP305V-D40D11-WN | Wafer | Active | 75V,1A,6.25W Bare die,31.100 X 31.100 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| CP305V-D40D11_WPD.PDF | Device Datasheet |
| Material Composition:TO-202 | Material Composition |
| Package Detail Document:TO-202 | Package Detail Document |
| Product EOL Notice:All Product in the TO-202 and | Product EOL Notice |
| Product Reliability Data:TO-202 Package Reliability | Product Reliability Data |
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Design Support
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- Application notes
- Application and design sample kits
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