CP310-2N3114
150V,200mA,800mW Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 50 mA
IB = 5 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 100 V
Test Conditions
VCB = 100 V
TA = 150 °C
Test Conditions
IC = 30 mA
Test Conditions
IC = 50 mA
IB = 5 mA
Test Conditions
VCE = 10 V
IC = 30 mA
f = 20 MHz
Test Conditions
VCE = 10 V
IC = 100 µA
Test Conditions
VCE = 10 V
IC = 30 mA
Test Conditions
VCE = 10 V
IC = 30 mA
TA = -55 °C
Test Conditions
IE = 100 µA
Test Conditions
VEB = 4 V
Test Conditions
VEB = 0.5 V
f = 140 kHz
Test Conditions
VCB = 20 V
f = 140 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP310-2N3114-CT | WafflePack@400 | Active | 150V,200mA,800mW Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP310-2N3114-WN | Wafer | Active | 150V,200mA,800mW Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| CP310-2N3114_WPD.PDF | Device Datasheet |
| Material Composition:TO-39 | Material Composition |
| Package Detail Document:TO-39 | Package Detail Document |
| Product Reliability Data:TO-39 Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development