CP310-2N6517
350V,500mA,625mW Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 10 V
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
IC = 20 mA
IB = 2 mA
Test Conditions
IC = 30 mA
IB = 3 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 250 V
Test Conditions
IC = 1 mA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
IC = 20 mA
IB = 2 mA
Test Conditions
IC = 30 mA
IB = 3 mA
Test Conditions
IC = 50 mA
IB = 5 mA
Test Conditions
VCE = 20 V
IC = 10 mA
f = 20 MHz
Test Conditions
VCE = 10 V
IC = 1 mA
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 30 mA
Test Conditions
VCE = 10 V
IC = 50 mA
Test Conditions
VCE = 10 V
IC = 100 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 5 V
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCB = 20 V
f = 1 MHz
Test Conditions
VCC = 100 V
IC = 50 mA
IB1 = 10 mA
IB2 = 10 mA
Test Conditions
VCC = 100 V
IC = 50 mA
IB1 = 10 mA
VBE = 2 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP310-2N6517-CT | WafflePack@400 | Active | 350V,500mA,625mW Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP310-2N6517-WN | Wafer | Active | 350V,500mA,625mW Bare die,25.980 X 25.980 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
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| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| CP310-2N6517_WPD.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
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