CP310-CJD340
300V,500mA,15W Bare die,25.980 X 25.980 mils,Transistor-Bipolar Power (>1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 1 A
VCE = 10 V
Test Conditions
VCB = 300 V
Test Conditions
IC = 1 mA
Test Conditions
VCE = 300 V
Test Conditions
IC = 100 mA
IB = 10 mA
Test Conditions
VCE = 10 V
IC = 50 mA
f = 10 MHz
Test Conditions
VCE = 10 V
IC = 50 mA
Test Conditions
VEB = 3 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP310-CJD340-CT | WafflePack@400 | Active | 300V,500mA,15W Bare die,25.980 X 25.980 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE | |
| CP310-CJD340-WN | Wafer | Active | 300V,500mA,15W Bare die,25.980 X 25.980 mils,Transistor-Bipolar Power (>1A) | EAR99 | 8541.29.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Ni added Al Bond Wire | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CP310-CJD340_WPD.PDF | Device Datasheet |
| Material Composition:DPAK | Material Composition |
| Package Detail Document:DPAK | Package Detail Document |
| Product EOL Notice:DPAK TRANSISTORS | Product EOL Notice |
| Product Reliability Data:DPAK Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CJD340 | Spice Model |
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Design Support
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- Application notes
- Application and design sample kits
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