CP310-MPSA43

Bare die,25.980 X 25.980 mils,High Voltage Transistor

Case Type: CHIP,WAFFLE

Base-Emitter Saturation Voltage (VBE(SAT))
750 mV
Collector-Base Breakdown Voltage (BVCBO)
450 V
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Voltage (VCBO)
450 V
Collector-Emitter Breakdown Voltage (BVCES)
450 V
Collector-Emitter Breakdown Voltage (BVCEO)
400 V
Collector-Emitter Cutoff Current (ICES)
500 nA
Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
750 mV
Collector-Emitter Voltage (VCEO)
400 V
Continuous Collector Current (IC)
300 mA
Current Gain-Bandwidth Product (fT)
20 MHz
DC Current Gain (hFE)
40
DC Current Gain (hFE)
50 — 200
DC Current Gain (hFE)
45
DC Current Gain (hFE)
20
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
6 V
Input Capacitance (Cib)
130 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
7 pF
Power Dissipation (PD)
2 W
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
62.5 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CP310-MPSA43-CM WafflePack@400 Active Bare die,25.980 X 25.980 mils,High Voltage Transistor EAR99 8541.29.0040 PBFREE
CP310-MPSA43-CT WafflePack@400 Active Bare die,25.980 X 25.980 mils,High Voltage Transistor EAR99 8541.29.0040 PBFREE
CP310-MPSA43-WN Wafer Active Bare die,25.980 X 25.980 mils,High Voltage Transistor EAR99 8541.29.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CP310-MPSA43_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document
Process Change Notice:WAFER THICKNESS REDUCTION Process Change Notice
Spice Model:Spice Model CP310 Spice Model

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