CP317-2N2857
15V,40mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
f = 450 MHz
IC = 1.5 mA
VCE = 6 V
Test Conditions
IC = 1 µA
Test Conditions
VCB = 15 V
Test Conditions
VCB = 15 V
TA = 150 °C
Test Conditions
VCB = 6 V
f = 31.9 MHz
IC = 2 mA
Test Conditions
IC = 3 mA
Test Conditions
VCE = 6 V
IC = 5 mA
f = 100 MHz
Test Conditions
VCE = 1 V
IC = 3 mA
Test Conditions
IE = 10 µA
Test Conditions
VCE = 6 V
IC = 1.5 mA
f = 450 MHz
RS = 50 Ω
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
IC = 12 mA
f = 500 MHz
VCB = 10 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP317-2N2857-CT | WafflePack@400 | Discontinued | 15V,40mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CP317.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
| Process Change Notice:WAFER THICKNESS REDUCTION | Process Change Notice |
| Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS | Product EOL Notice |
| Spice Model:Spice Model CP317 | Spice Model |
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