CP317X-2N5770
15V,50mA,625mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A)
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
f = 200 MHz
VCB = 12 V
IC = 6 mA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
f = 500 MHz
VCB = 15 V
IC = 8 mA
Test Conditions
IC = 1 µA
Test Conditions
VCB = 15 V
Test Conditions
VCB = 15 V
TA = 150 °C
Test Conditions
IC = 3 mA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
VCE = 10 V
IC = 8 mA
f = 100 MHz
Test Conditions
VCE = 1 V
IC = 3 mA
Test Conditions
VCE = 1 V
IC = 8 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCE = 6 V
IC = 1 mA
f = 60 MHz
RG = 400 Ω
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
f = 500 MHz
VCB = 15 V
IC = 8 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CP317X-2N5770-CT | WafflePack@400 | Active | 15V,50mA,625mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) | EAR99 | 8541.21.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
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| CP317X-2N5770_WPD.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:TO-92 process change eutectic | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
| Spice Model:2N5770 | Spice Model |